Higher automatic BGA repair machine, WDS-750

Model Number: WDS-750 BGA repair machine Brand Name: Wisdomshow ( WDS ) Key Specifications/Special Features: WDS-750 high-end BGA rework station Specifications1. Touch screen with a human interface, heating time, heating temperature, reflow temperature rate, advanced alarming, vacuum time all can set the touch screen, simple operation, easily learn.2. PLC import from Japan, temperature control module use China famous brand, display three temperature curves, 4pcs independent temperature sensor, which can measure the different place temperature of the chips, make sure the rework rate.3. Three independent heating temperature zone, each heating temperature zone can independently set the heating temperature, heating time, rate, six heating temperature sections, Simulate the reflow oven heating mode preheating, constant, warming, soldering, reflow soldering, cooling.4. Auto feed chips, pick up chips, blowing chips, auto recognition chips place during alignment Multifunction mode weld, remove, mount, manual, realize semi-auto and auto function, meet customer’s requirement.5. High precision K-type closed loop import from the US together with our company special heating way, the soldering range of temperature within ±1 degree.6. Imported optical alignment system with 15’’ high definition monitor, high-precision micrometer adjust X/Y/R axis, make sure the alignment precision within 0.01-0.02mm.7. Top heater and mounting heater design 2 in 1 which can make the mounting more precision, there are many sizes of BGA nozzles which can meet different chips sizes, BGA nozzles can easy change, we accept customize.8. High automatic and precision, completely avoid human operation error; it is good for reworking lead-free craft and double BGA, QFN, QFP, capacitance-type resistor components which can achieve a good result.9. Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result (optional function) Type BGA rework reballing machine, motherboard repair machine Total power Max 6800W Power supply
(Single Phase)AC 220V±1050Hz
Position way
Optical lens+Vshape holder+laser positioning
Material
High sensitive touch screen+temperature control module+PLC+step drive
PCB size Max:500×450mm，Min:10×10mm
Applicable BGA size 0.8mm-8cm
Mounting precision
±0.01mm
Min.chips pitch
0.15mm
Mounting BGA weight
1000G
PCB thickness
0.5-8mm
Thermo-couple Ports
4pcs Overall dimension
L670×W780×H850mm
Weight of machine About 90kg